Qisheng Precision exhibited at the 26th China International Optoelectronics Exposition in Shenzhen. Visitors discovered the latest developments in precision dicing saws, diamond blades and grinding wheels for the semiconductor, LED and photovoltaic sectors.
Metal bond agents are critical materials in diamond tool manufacturing. As key components, they directly determine performance characteristics of grinding wheels and dicing blades. As technology advances, bond agent performance continues to improve and application areas continue to expand.
Electronics industry cutting equipment refers to machines used in manufacturing electronic products to cut electronic components and circuit boards. Key trends include higher spindle speeds, improved wafer handling automation, AI-based defect detection and tighter dimensional tolerances for next-generation packaging.
High-precision dicing saws are specialised tools for superhard materials such as diamond and cubic boron nitride (CBN). Using advanced cutting technology and precision control systems, they achieve high-accuracy, high-efficiency cutting across semiconductor, aerospace and energy sectors.