Qisheng Precision
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Solutions

Semiconductor Industry

Silicon Wafer Dicing & Thinning

Qisheng offers a complete solution for silicon wafer processing — from precision dicing saws configured for 6"/8"/12" wafers to purpose-developed thinning and chamfering grinding wheels.

  • Diamond thinning wheels for 6", 8", 12" silicon wafers with excellent flatness
  • Chamfering wheels already replacing imported wheels at multiple Chinese fabs
  • Dicing blades optimised for silicon: tight kerf, low chipping, long life
  • Compatible with Disco, ACCRETECH and domestic grinder/dicer brands
  • Custom specifications available on request
Semiconductor wafer dicing
LED Industry

LED Sapphire Substrate Processing

Sapphire is one of the hardest commercially processed substrates. Qisheng's diamond wheels and blades are specifically formulated for sapphire's extreme hardness and thermal properties.

  • Sapphire thinning wheels for 2", 4", 6" wafers — stable, no deep scratches
  • Sapphire chamfering wheels: high precision edge profile, very long wheel life
  • Blade formulations for GaAs and GaN-on-sapphire epitaxial wafers
  • High cost-performance ratio vs imported alternatives
LED sapphire processing
Photovoltaic Industry

Mono & Polycrystalline Silicon Grinding

Efficient grinding and edge processing of mono- and polycrystalline silicon ingots and wafers for high-output solar cell production lines.

  • Combined grinding-chamfering wheels for both mono and poly silicon
  • High material removal efficiency, long service life
  • Low surface damage layer — critical for cell efficiency
  • Compatible with Takatori, Koyo, Lian Cheng, Rong Zhi and domestic equipment
  • Custom specifications for any cell geometry
Photovoltaic solar grinding
IC Packaging — QFN/DFN

QFN / DFN Singulation

As QFN/DFN packages shrink in pitch and increase in variety, the demands on dicing blade performance escalate. Qisheng has developed dedicated bonding solutions for this segment.

  • Resin-bond blades with new thermosetting formulation: vertical wear preserves kerf
  • Effective copper burr suppression — critical for exposed-pad QFN
  • Improved abrasion resistance vs traditional resin blades
  • QSD0830 and QSD1030 dicing saws optimised for large-format strips
IC packaging QFN DFN
Glass & Ceramics

Brittle Hard Materials Processing

Precision dicing of brittle non-semiconductor substrates requires blades that maintain vertical geometry at high feed rates while minimising chipping.

  • Metal-bond blades: high-strength micro-fractured diamond, rigid binder
  • Continuous self-sharpening at elevated feed rates
  • Wide compatibility: electronic ceramics, optical glass, LiNbO₃, magnetic materials
  • Ideal for complex designs with many part variants
Glass ceramics dicing