The QSD series covers wafer sizes from 6" to 10", addressing the full range of IC packaging, LED, solar cell and optical component dicing applications. 250 dicing saws were sold globally in 2025, demonstrating the proven reliability of the platform.
| Model | Wafer Size | Spindle | Application | Status |
|---|---|---|---|---|
| QSD0620 | 6" (150 mm) | Air-bearing DC | IC, LED, solar, optical, ceramics | — |
| QSD0630 | 6" (150 mm) | Air-bearing DC | IC, LED, solar, optical, fiber optic, ceramics | Best Seller |
| QSD0636 | 6" (150 mm) | Air-bearing DC | IC, LED, electronic ceramics, fiber optic | — |
| QSD0830 | 8" (200 mm) | High-power DC | QFN, BGA, PCB — large travel, auto recognition | Best Seller |
| QSD1030 | 10" (250 mm) | High-power DC | QFN, DFN, large-format IC packaging | New |
Compact 6" platform for IC, LED, solar cells, optical components, fiber optics and ceramics.
Best-selling 6" platform — proven reliability across hundreds of installations in semiconductor and LED.
Extended 6" platform with enhanced fiber optic and electronic ceramic dicing capability.
Best-selling 8" platform with high-power DC spindle for QFN, BGA and PCB semiconductor packaging.
Largest QSD platform for large-format QFN/DFN strips and high-volume IC packaging.
Qisheng's blade portfolio covers resin-bond, metal-bond and electroformed types, with formulations optimised for specific substrates and process requirements. All blade specifications can be customised on request. Compatible with all major dicing saw brands including Disco, ACCRETECH (Tokyo Seimitsu) and domestic equivalents.
| Blade Type | Bond System | Ideal Substrates | Key Advantage |
|---|---|---|---|
| Resin-Bond | Thermosetting resin | QFN/DFN packaging, IC leadframe, composites | Vertical wear; copper burr suppression; long life |
| Metal-Bond | Rigid metal sinter | Glass, ceramics, LiNbO₃, magnetic materials | Continuous self-sharpening at high feed |
| Electroformed | Nickel electrodeposition | Silicon, GaAs, LiNbO₃, sapphire epitaxial | Ultra-thin kerf; excellent surface finish |
Purpose-developed diamond grinding wheels for wafer thinning, chamfering and photovoltaic cell edge processing. Proven domestic replacement for imported grinding wheels at multiple Chinese semiconductor fabs.
Mono & polycrystalline silicon. High speed, high efficiency, long life, low surface damage.
6", 8", 12" wafers. Stable quality, high consistency, long life. Domestic replacement for imported wheels.
2", 4", 6" sapphire wafers. Stable, no deep scratches or chipping, very long life.
All accessories are manufactured in-house to ensure dimensional compatibility with Qisheng dicing saws and compatibility with third-party machines.
Precision flatness, excellent thermal stability, multiple chuck patterns available.